Description of the Pico-Technologies stacked MCM for Nanosat: Advanced Packaging Press Release Snapstrate and Socket for Chip-on-Board Programmable Technologies, September 1998 Author: J. Plante Reliability Issues Related to Fatigue Strength of Gold Wire Used in Electronic Assemblies, November 1998 Author: C. Eveland Vibration-induced Fatigue Failures in Bonding Wires Used in Stacked Chip Modules,1998 Authors: Dr. Henning Leidecker, Scott Hull Evaluation of the Die Attachment, Ablestik 84-1, for its Reliability for TDRS, September 1998 Authors: J. Kadesch, H. Shaw, G. Rose The High-Speed Potential of Multi-Chip Modules Built with Pico-Substrates Author: Pico-Technology Inc. Structural Design and Analysis of a Light-Weight Laminated Composite Heat Sink for Spaceflight PWB's, NASA Technical Paper 3679 Authors: Dr. Mark Fan, W. Lee Niemeyer