Objective of the Evaluation
Task: Underfill evaluation to improved the reliability of the interconnect using Pin Grid Array (PGA)
attachment between the board and the components. Evaluate reworkability of underfill systems.
- several types of underfill materials have been selected for the evaluation
- test plan is completed
- determines the suitable underfill for space application with PGA
- compared data from PGA to Ball Grid Array (BGA)
- compromise the CTE mismatch between the board and the component